GlobalFoundries will make AI chip parts for TSMC in the US
The $2 billion deal runs for five years at first. GlobalFoundries will make silicon interposers, a key part of TSMC’s advanced AI chip packages, in New York from 2028.
GlobalFoundries announced a $2 billion agreement with TSMC on October 8. It will make silicon interposers for TSMC’s CoWoS chip packaging at its factory in Malta, New York. Volume production should start in the first half of 2028. GlobalFoundries says it will be the first US source of these parts, and TSMC has not commented.